Laser measurement and fringe projection proп¬Ѓlometry (FPP) measurement.

The measurement technologies discussed in research regarding theДЈ-D measurement of п¬‚ip-chip solder bump include X-ray detection, High precision 3-D measurement technology is required in the п¬‚ip-chip packaging feedback Small (15вЂ“140 Вµm) in order for the high precision measurement toДЄvoid the defects of open- or short-circuit. In order to ensure the signal connection of п¬‚ip-chip electronic components, the height measurement of п¬‚ipchip solder bump is very important. The solder bump size reduction and density increasing will aп¬Ђect the (LSI) technique, presented IC chips functional increasing complexity, the volume reduction, and the number of pa ckage pins increasing. Small size, and high-speed operation ability, e.g. Product design trend for electronic products includes light thinness, With improved quality of life and greater market demand, the The proposed system has a good measurement results and robust stability in the solderД«ump measurement, and can be used for the measurement of 3-D information for micron п¬‚ip-chip solder bump In the п¬‚ip-chip solder bump measuring experiment, diп¬Ђerent fringe modulationД¬onп¬Ѓgurations were tested to overcome the problem of reп¬‚ective coeп¬ѓcient between the п¬‚ip-chip base boardДЄnd the solder bump. The results thus proved that the proposed 3-D measurement system is eп¬Ђective in measuring a plane TheД®xperimental results showed that the average measurement accuracy is 0.43Ојm and the standard deviation isДЎ.38 Вµm. Proposed a multi-channel composite phase unwrapping algorithm, which uses fringe modulation weights ofДiп¬Ђerent channels to recombine the phase information for better measurement accuracy and stability. Modulation intensities in color channels, in order to produce color composite fringe with robustness, and This study developed a 3-D measurement system based on п¬‚ip-chip solder bump, used fringes with diп¬Ђerent Graduate Institute of Automation and Control, National Taiwan University of Science and Technology, Taipei 10607, Taiwan, ROC Journal homepage: Application of robust color composite fringe in п¬‚ip-chip solder bump 3-D Optics and Lasers in Engineering 91 (2017) 261вЂ“269Д¬ontents lists available at ScienceDirect

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